Spray Coating Material Layer

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Spray Coating Material Layer
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Spraying area: coating spray coating production line of target
Work status: coating spraying layer of target
Solution: plasma spraying
Coating material: silicon aluminum target material
Effect: all kinds of qualified target material
Areas of application: the company adopts the method of plasma spraying production target, professional development, production and sales of vacuum magnetron sputtering target materials, used in glass coating (architecture glass and automobile glass) industry and other industries, the main target of material including: chromium target, titanium target, silicon aluminum target, the company can be developed according to customer requirements to meet customer requirements and provide all kinds of target material spraying manufacturing technology: 1, the target system of plasma spraying powder equipment turnkey project 2, target material selection, formula of plasma spraying powder, milling process


Magnetron sputtering target material
Magnetron sputtering deposition is a new kind of physical vapor phase deposition method, compared with the early way of evaporation coating, its many advantages is quite obvious. As a development has a mature technology, magnetron sputtering has been applied in many fields.

Magnetron sputtering principle: in the sputtering target pole (cathode) between the anode and an orthogonal magnetic and electric fields, in the high vacuum chamber by filling the need of inert gas (usually the Ar gas), a permanent magnet in the target material surface form 250 ~ 350 gauss magnetic field, with high voltage electric field of orthogonal electromagnetic field. Under the action of electric field, Ar gas into positive ions and electrons, target and has certain negative pressure, from the target from the pole by the effect of magnetic field and the working gas ionization probability increase, form a high density plasma near the cathode, Ar ion under the action of lorentz force, speed up to fly to the target surface, bombarding target surface at a high speed, the target is follow the principle of momentum transfer atoms sputtering out by higher kinetic energy from the target surface to substrate deposition film. Magnetron sputtering generally fall into two categories: a tributary of sputtering and rf sputtering, and the tributaries of sputtering equipment simple principle, when the sputtering metal, its speed is fast. Rf sputtering and the use of more extensive, besides can splash conductive material, can also be sputtering of conductive materials, as well as department of reaction sputtering chemical compounds such as preparation of oxide, nitride and carbide materials. If the frequency of the radio frequency increase became microwave plasma sputtering, at present commonly used are electron cyclotron resonance (ECR) microwave plasma sputtering.

Magnetron sputtering coating material:
Metal sputtering target material, coating alloy sputtering coating material, ceramic sputtering coating material, boride ceramic sputtering target materials, carbide ceramic sputtering target material, fluoride ceramic sputtering target material, nitride ceramic sputtering target materials, oxide ceramic target, selenide ceramic sputtering target material, silicide ceramic sputtering target materials, sulfide ceramic sputtering target material, telluride ceramic sputtering target material, other ceramic material, a silicon oxide ceramic target material doped chromium (Cr) - the SiO), indium phosphide (InP) target material, arsenic lead target material (PbAs), indium arsenide target material (InAs).
High purity high density construction material are:
Sputtering target materials (purity: 99.9% - 99.999%)

Metal material:
Nickel target target, Ti, Zn, Ni, Ti target target target, Cr, magnesium, zinc, chromium, Mg, niobium target, Nb, target, target, Al, Sn, aluminum tin indium target, target, Fe, zirconium and iron In aluminum target, ZrAl target, TiAl, zirconium, titanium, aluminum target, Zr target, AlSi, silicon, aluminum, silicon target target Cu, Si, Cu and ta target T, a, germanium target, target, Ag, Ge, silver cobalt target, target, Au, Co, gold gadolinium targets, Gd, target, target, Y La, yttrium, lanthanum cerium tungsten target, Ce, target, w target, stainless steel, nickel chromium target, NiCr target, target, Hf, molybdenum hafnium target, FeNi, w, Mo, iron nickel target, w, etc.

Equipment recommended
Solution: plasma spraying equipment/material selection, formula of plasma spraying powder, milling process
Spraying materials: technical planning: reach or exceed the design requirements

Plasma spraying equipmenthigh-power electric arc spraying equipmentautomatic sandblasting equipmentspraying production line soundproof roomAutomatic spraying systems
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